Scaling Bandwidth with Modular Interconnects: One Lane at a Time

In today’s fast-paced world of technology, systems demand ever-increasing speed, seamless upgrades, and zero downtime. Scaling bandwidth shouldn’t require rebuilding your entire infrastructure. At Mitas Electronics, we specialize in custom interconnect solutions, using a variety of high-performance connectors such as IPEX and other industry-standard options, all designed for modularity. Let’s explore how modularity works, using QSFP as an example.

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FirstHeading

What Does Modular Mean for Your System?
Understanding Lanes: The Key to Scalable Bandwidth
Why Choose Mitas for Modular Interconnects?
Thermal Management
From Prototype to Production
Ready for the Future
Scale Smarter with Mitas

What Does Modular Mean for Your System?

Modularity is about flexibility and adaptability. Our interconnect solutions—cables, connectors, and assemblies—are designed as standardized, interchangeable components. This allows you to upgrade or replace individual parts without redesigning your board or halting development. Whether you’re increasing bandwidth or adapting to new standards, modularity ensures your system evolves effortlessly.
The key to this scalability lies in lanes—high-speed data paths that form the backbone of modern systems.

Understanding Lanes: The Key to Scalable Bandwidth

A lane is a high-speed data path, typically a differential pair of traces or wires, that carries a stream of digital signals. The more lanes your system supports, the greater your total bandwidth. This architecture allows you to start with a few lanes and scale by adding more in parallel as your needs grow.

To illustrate modularity, let’s look at QSFP as an industry-standard example:

SFP28: A single lane delivering 25 gigabits per second (Gbps). Compact and ideal for point-to-point connections.
QSFP28: Four Tx lanes, each at 25 Gbps, for a total of 100 Gbps.
QSFP56: Four Tx lanes at 50 Gbps each, reaching 200 Gbps.
QSFP-DD (Double-Density): Eight Tx lanes in the same port size, enabling 400 Gbps with NRZ signaling or up to 800 Gbps with PAM4.
OSFP-XD: A 16-lane Tx module targeting up to 1.6 terabits per second (Tbps) with next-gen PAM4 signaling.

QSFP’s backward compatibility highlights modularity’s power. For example, a 100G QSFP28 module can operate in a 400G QSFP-DD port, allowing incremental upgrades without system overhauls.

At Mitas, we apply the same modular philosophy using a range of connectors, including IPEX and other high-performance options. These connectors support multiple lanes and are ideal for applications where space, performance, and flexibility are critical. Like QSFP, our connectors allow you to scale bandwidth by adding lanes or upgrading to higher-speed configurations without redesigning your system.

Enterprise Solutions Development of LEAPWIRE™DUALINE™ series for 112 Gbps PAM4, and Board-to-

Why Choose Mitas for Modular Interconnects?

Mitas Electronics specializes in custom, high-speed interconnect assemblies using a variety of connectors, such as I-PEX, Hirose, JAE and other industry-standard options, tailored to your needs.

Built for Performance

Our interconnects prioritize signal integrity and reliability, featuring:

Low-loss materials for minimal signal degradation.
Precision Engineering for optimum signal integrity performance.
Advanced EMI shielding to reduce interference.
Advanced manufacturing methods and equipment for consistent performance.

Thermal Management

High-speed systems generate heat. Our assemblies support high-power modules with custom heatsinks and airflow solutions, ensuring your system stays cool under pressure.

From Prototype to Production

We partner with engineering teams at every stage, solving complex layout challenges and delivering tailored assemblies through our global manufacturing network. Whether you’re routing a single high-speed lane or a multi-lane backbone with our connectors, Mitas provides interconnects that perform.

Ready for the Future